Paras Semiconductors
Private Limited
a subsidiary of Paras Defence and Space Technologies Limited, is developing advanced semiconductor packaging capabilities designed to support the next generation of high-performance electronics.
Six Pillars. One Semiconductor Future.
India’s Semicon 2.0 is building a complete semiconductor ecosystem.
Paras Semiconductors is advancing the packaging layer that connects semiconductor technologies, manufacturing and end applications.
Aligned with the six pillars of the Indian Semiconductor Mission 2.0, we are focused on advanced packaging and OSAT to enable a stronger, self-reliant semiconductor industry.
Chip Design
Supporting the integration of logic, memory and specialised dies into advanced semiconductor packages.
Machines & Materials
Leveraging advanced assembly equipment, substrates and specialised materials for reliable packaging.
Semiconductor Fabs
Connecting wafer fabrication with finished semiconductor components through assembly, packaging and testing.
Advanced Packaging
Developing advanced packaging solutions, including heterogeneous integration and high-density interconnects.
Research & Development
Focusing on package architectures, interconnects, thermal management and process innovation.
Talent Development
Developing specialized expertise in semiconductor assembly, testing, quality and manufacturing.
Our Development Roadmap.
Paras Semiconductor’s proposed facility development is structured across two overlapping phases, with a planned six-year development horizon.
Phase 1 establishes the facility and core packaging capabilities.
Phase 2 expands into next-generation integration and scale-up.
Phase 1 | 2027 – 2028 — Building the foundation
Phase 2 | 2029 – 2032 — Scaling capabilities